CX-028293: Photonic Curing of Printed Copper Contacts for High Efficiency and Low Cost Silicon Heterojunctions

The U.S. Department of Energy (DOE) is proposing to provide funding to University of Central Florida (UCF) for the design, development, fabrication…

Office of NEPA Policy and Compliance

June 23, 2023
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The U.S. Department of Energy (DOE) is proposing to provide funding to University of Central Florida (UCF) for the design, development, fabrication, and characterization of a printable copper metallization process that is easier to fabricate and that degrades less than silver-based metallization.