SAFI-Tech proposes to develop a new form factor for soldering metal alloy SnAg3.0Cu0.5 ,SAC305, used to create conductive interconnects when mounti…
Office of NEPA Policy and Compliance
June 4, 2020
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SAFI-Tech proposes to develop a new form factor for soldering metal alloy SnAg3.0Cu0.5 ,SAC305, used to create conductive interconnects when mounting thin, high-density, high-energy particle detectors onto substrates.