A Tight Enclosure on the Path to Net Zero

Lead Performer: Highland Park Technologies, LLC – Boston, MA
Partners:
-- Oak Ridge National Labs – Oak Ridge, TN
-- Simpson Gumpertz & Heger – Waltham, MA
DOE Total Funding: $1,500,000
Cost Share: $375,000
Project Term: October 1, 2023 – September 30, 2026
Funding Type: Buildings Energy Efficiency Frontiers & Innovation Technologies (BENEFIT) – 2022/23

Project Objective

Exterior walls of older buildings allow considerable waste through air leakage and ineffective insulation. In order to significantly reduce building energy consumption and meet national climate goals, this project will develop “HP Panel” made entirely with bio-based materials as a viable alternative to the petrochemical‐intensive retrofit wall panels that are currently available. With a target thermal performance of R25 or better and installation cost of $10/square foot, this project will streamline the digitization of existing building conditions and measurement to assist prefabrication and installation of HP Panels, speedy and accurate computer‐aided manufacturing (CAM), and full-scale application on two to three buildings leveraging clip attachment system and snap-together subassembly that is lightweight and easy to install using conventional means and methods. Additional industry standard tests will be performed on both the cladding materials and clip attachment system for performance and durability during the 12-month monitoring period, including:

1. Confirmation of the structural, thermal, and moisture behavior of the composite insulated panels.
2. Confirmation of acceptable performance of the substructure and clip system, including transitions and panel‐to‐panel connections. 
3. Review of aesthetic durability.

Project Impact 

An opaque envelope upgrade can improve building energy performance by 50%, substantially reducing air leakage and heat transfer through walls. With the global push toward net‐zero energy use, a wood fiber panel system has the potential to address the U.S. mid‐scale multi‐family market for deep energy retrofits valued at $99 billion. With the high costs associated with displacing or relocating tenants to undertake interior retrofits, approaches to rapidly retrofit from the exterior are attractive to property owners and occupants. HP Panels will be fabricated off-site based on the specific dimensions of existing buildings, greatly reducing material and demolition waste compared to on-site overclad envelope retrofits. The panels employ a clip system, facilitating a quick and easy envelope retrofit, and a wood fiber‐based insulation substrate with a high insulating value and low embodied carbon. 

Contacts

DOE Technology Manager: Sven Mumme
Lead Performer: Evan Smith, Highland Park Technologies, LLC